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About This Item

 

Full Description

Updated with extended support for components used for lead free assembly! This standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress. It is used to determine which classification level should be used for initial reliability qualification. These devices can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during solder reflow attachment. Developed by IPC and JEDEC.
 

Document History

  1. IPC J-STD-020E


    Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

    • Most Recent
  2. IPC J-STD-020D-1


    Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

    • Historical Version
  3. IPC J-STD-020D

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    viewing


    Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

    • Historical Version
  4. IPC J-STD-020C


    Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Device

    • Historical Version
  5. IPC J-STD-020B


    Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

    • Historical Version
  6. IPC J-STD-020A


    Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices

    • Historical Version