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IPC 4203B

Cover and Bonding Material for Flexible Printed Circuitry

standard by Association Connecting Electronics Industries, 03/01/2018

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About This Item

 

Full Description

IPC 4203B establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides. These materials are to be used as cover material for flexible printed circuitry as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. The standard does not address nonflexible adhesives designed to be used in the rigid board areas of rigid flex constructions which are addressed in IPC-4101. Materials such as liquid-applied covercoat are delineated in IPC-SM-840 and are excluded from this document. The requirements herein meet or exceed the requirements for Class 3 which, in turn, meet or exceed conformance to Classes 1 and 2.
 

Product Details

Published:
03/01/2018
Number of Pages:
52
File Size:
1 file , 680 KB
Product Code(s):
4203-STD-0-D-0-EN-B
 

Document History

  1. IPC 4203B

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    viewing


    Cover and Bonding Material for Flexible Printed Circuitry

    • Most Recent

  2. IPC 4203A


    Cover and Bonding Material for Flexible Printed Circuitry

    • Historical Version

  3. IPC 4203


    Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films

    • Historical Version

  4. IPC FC-232C


    Specification for Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring

    • Historical Version