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About This Item

 

Full Description

The IPC-7095D-AM1 standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D-AM1 provides the useful and practical information to those who use or are considering using BGAs. IPC-7095D-AM1 provides descriptions on how to successfully implement robust design and assembly processes for printed board assemblies using BGAs as well as ways to troubleshoot some common anomalies which can occur during BGA assembly.
 

Document History

  1. IPC 7095D-WAM1

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    viewing


    Design and Assembly Process Implementation for BGAs, with Amendment 1

    • Most Recent
  2. IPC 7095D


    Design and Assembly Process Implementation for BGAs

    • Historical Version
  3. IPC 7095C


    Design and Assembly Process Implementation for BGAs

    • Historical Version
  4. IPC 7095B


    Design and Assembly Process Implementation for BGAs

    • Historical Version
  5. IPC 7095A


    Design and Assembly Process Implementation for BGAs

    • Historical Version