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About This Item

 

Full Description

Now updated for lead free assembly and rework! This standard identifies the classification level of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress. This standard now covers components to be processed at higher temperatures for lead free assembly. It is used to determine what classification level should be used for initial reliability qualification. These devices can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during solder reflow attachment and/or repair operation.

 

Document History

  1. IPC J-STD-020F


    Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

    • Most Recent
  2. IPC J-STD-020E


    Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

    • Historical Version
  3. IPC J-STD-020D-1


    Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

    • Historical Version
  4. IPC J-STD-020D


    Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

    • Historical Version
  5. IPC J-STD-020C

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    Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Device

    • Historical Version
  6. IPC J-STD-020B


    Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

    • Historical Version
  7. IPC J-STD-020A


    Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices

    • Historical Version