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About This Item

 

Full Description

The purpose of this standard is to identify the classification level of non-hermetic solid state surface mount devices that are sensitive to moisture-induced stress. They can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during the assembly solder reflow attachment and/or repair operation. This standard is used to determine what classification level should be used for initial reliability qualification.
 

Document History

  1. IPC J-STD-020E


    Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

    • Most Recent
  2. IPC J-STD-020D-1


    Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

    • Historical Version
  3. IPC J-STD-020D


    Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

    • Historical Version
  4. IPC J-STD-020C


    Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Device

    • Historical Version
  5. IPC J-STD-020B


    Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

    • Historical Version
  6. IPC J-STD-020A

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    Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices

    • Historical Version