BS EN 60068-2-58:2015 outlines test Td, applicable to surface mounting devices (SMD).

This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.

The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems.

The solder bath method is applicable to SMDs designed for flow soldering and SMDs designed for reflow soldering when the solder bath (dipping) method is appropriate.

The reflow method is applicable to the SMD designed for reflow soldering, to determine the suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not appropriate.

The objective of this standard is to ensure solderability of component lead or termination. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering.


Cross References:
IEC 60068-1
EN 60068-1
IEC 60068-2-20:2008
EN 60068-2-20:2008
IEC 60194
EN 60194
IEC 61190-1-1
EN 61190-1-1
IEC 61190-1-2:2014
EN 61190-1-2:2014
IEC 61190-1-3:2007
IEC 61190-1-3:2007/A1:2010
EN 61190-1-3:2007/A1:2010
IEC 61191-2
EN 61191-2
IEC 61249-2-22
EN 61249-2-22
IEC 61249-2-35
EN 61249-2-35
IEC 61760-1
EN 61760-1
ISO 9454-2:1998
EN ISO 9454-2:2000
IEC 60068-2-54
EN 60068-2-54
IEC 60068-2-69
EN 60068-2-69
IEC TR 60068-3-12
IEC 60068-3-13
IEC 60749-20
EN 60749-20
IEC 61760-3
EN 61760-3
IEC 61760-4
EN 61760-4
J-STD 020D
J-STD 075


All current amendments available at time of purchase are included with the purchase of this document.