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Cross References: IEC 60068-1:1988*IEC 60068-2-20:1979*IEC 60068-2-44:1995*IEC 60068-2-54:1985*IEC 60068-2-69:1995*IEC 60249-2-4:1987*IEC 60749:1996*

Replaces BS 2011-2.1Td:1990 which remains current.

Replaced by BS EN 60068-2-58:2004 but remains current.
 

Document History

  1. BS EN 60068-2-58:2015+A1:2018


    Environmental testing-Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    • Most Recent
  2. BS EN 60068-2-58:2015


    Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    • Historical Version
  3. BS EN 60068-2-58:2004


    Environmental testing-Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    • Historical Version
  4. BS EN 60068-2-58:1999

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    Environmental testing. Test methods-Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    • Historical Version
  5. BS 2011-2.1TD:1990


    Environmental testing. Tests-Test Td. Solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    • Historical Version