1100726

BS 2011-2.1TD:1990

Environmental testing. Tests-Test Td. Solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

standard by BSI Group , 08/31/1990

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About This Item

 

Full Description

Procedure for testing the effects of soldering using a solder bath. Applicable only to products designed to withstand short term immersion in molten solder. To be read in conjunction with Part 1.1

Cross References: BS 2011:Part 1.1*BS 2011:Part 2.1T*BS 2011:Part 2.1Ta*BS 2011:Part 2.2T*

Replaced by BS EN 60068-2-58:1999 but remains current.
 

Product Details

Published:
08/31/1990
ISBN(s):
058018806X
Number of Pages:
16
File Size:
1 file , 4.2 MB
Product Code(s):
222184, 222184, 00222184
Note:
This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. BS EN 60068-2-58:2015+A1:2018


    Environmental testing-Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    • Most Recent

  2. BS EN 60068-2-58:2015


    Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    • Historical Version

  3. BS EN 60068-2-58:2004


    Environmental testing-Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    • Historical Version

  4. BS EN 60068-2-58:1999


    Environmental testing. Test methods-Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    • Historical Version

  5. BS 2011-2.1TD:1990

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    Environmental testing. Tests-Test Td. Solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    • Historical Version