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Cross References:
IEC 60068-1:1988
IEC 60068-2-20:1979
IEC 60194:1999
IEC 60749-20:2002
IEC 61190-1-1:2002
IEC 61190-1-2:2002
IEC 61190-1-3:2002
IEC 61191-2:1998
IEC 61249-2-7:2002
IEC 61760-1:1998
EN 60068-1:1994
CENELEC HD 323.2.20 S3:1988
EN 60749-20:2003
EN 61190-1-1:2002
EN 61190-1-2:2002
EN 61190-1-3:2002
EN 61191-2:1998
EN 61249-2-7:2002
EN 61760-1:1998
IEC 60068-2-44:1995
IEC 60068-2-54:1985
IEC 60068-2-69:1995
 

Document History

  1. BS EN 60068-2-58:2015+A1:2018


    Environmental testing-Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    • Most Recent
  2. BS EN 60068-2-58:2015


    Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    • Historical Version
  3. BS EN 60068-2-58:2004

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    Environmental testing-Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    • Historical Version
  4. BS EN 60068-2-58:1999


    Environmental testing. Test methods-Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    • Historical Version
  5. BS 2011-2.1TD:1990


    Environmental testing. Tests-Test Td. Solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    • Historical Version