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BS EN 61190-1-2:2014

Attachment materials for electronic assembly-Requirements for soldering pastes for high-quality interconnects in electronics assembly

standard by British-Adopted European Standard , 06/30/2014

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Cross References:
IEC 60194
IEC 61189-5-3
IEC 61190-1-1
IEC 61190-1-3
ISO 9454-2
EN 60194
EN 61189-5-3
EN 61190-1-3
EN ISO 9454-2
IEC 61189-5:2006
IEC 61189-6:2006
EN 61189-5:2006
EN 61189-6:2006
IPC-HDBK-005


All current amendments available at time of purchase are included with the purchase of this document.
 

Product Details

Published:
06/30/2014
ISBN(s):
9780580778407
Number of Pages:
26
File Size:
1 file , 1.4 MB
Product Code(s):
30258439, 30258439, 30258439
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This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. BS EN 61190-1-2:2014

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    Attachment materials for electronic assembly-Requirements for soldering pastes for high-quality interconnects in electronics assembly

    • Most Recent

  2. BS EN 61190-1-2:2007


    Attachment materials for electronic assembly-Requirements for soldering pastes for high-quality interconnects in electronics assembly

    • Historical Version

  3. BS 05/30133283 DC


    IEC 61190-1-2 ED 2. Attachment materials for electronic assembly. Part 1-2. Requirements for soldering paste for high-quality interconnects in electronics assembly

    • Historical Version

  4. BS EN 61190-1-2:2002


    Attachment materials for electronic assembly-Requirements for solder pastes for high-quality interconnections in electronic assembly

    • Historical Version