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Full Description

A revised method for determining the effects of bias conditions and temperature, over time, on solid state devices is now available. Revision B of A108 includes low temperature operating life (LTOL) and high temperature gate bias (HTGB) stress conditions, revised cool down requirements for high temperature stress, and a procedure to follow if parts are not tested within the allowed time window.
 

Document History

  1. JEDEC JESD22-A108G


    TEMPERATURE, BIAS, AND OPERATING LIFE

    • Most Recent
  2. JEDEC JESD22-A108F


    TEMPERATURE, BIAS, AND OPERATING LIFE

    • Historical Version
  3. JEDEC JESD22-A108E


    TEMPERATURE, BIAS, AND OPERATING LIFE

    • Historical Version
  4. JEDEC JESD22-A108D


    TEMPERATURE, BIAS, AND OPERATING LIFE

    • Historical Version
  5. JEDEC JESD 22-A108C

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    TEMPERATURE, BIAS, AND OPERATING LIFE

    • Historical Version