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The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. Solder ball shear is a destructive test.
 

Document History

  1. JEDEC JESD22-B117B

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    SOLDER BALL SHEAR

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  2. JEDEC JESD22-B117A


    SOLDER BALL SHEAR

    • Historical Version