BS EN 60068-2-69:2017 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass?fail purposes.

The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads.

This document provides the measurement procedures for solder alloys both with and without lead (Pb).


Cross References:
IEC 61190-1-3:2007 Cons Ed 2-1
ISO 683-4:2014 ED1
ISO 683-3:2016
ISO 683-4:2016
IEC 61190-1-3:2007/AMD1:2010
ISO 683-1:2016
IEC 60068-2-2 Ed.5.0
IEC 60068-1:2013
ISO 683-2:2016
IEC 60068-2-66:1994
IEC 60068-2-20:2008
ISO 683-17:1999 IPC J-STD-003C
ISO 6362-7:2012 ED1
ISO 9453:2014 ED3
ISO 6362-3:2012
ISO 6362-2:2014 ED4
ISO 6362-5:2012
ISO 6362-1:2012
IEC 61190-1-1:2002 Ed 1
ISO 9454-1:1990
ISO 6362-4:2012
IEC 60068-3-13:2016
ISO 6362-6:2012 ED1


All current amendments available at time of purchase are included with the purchase of this document.