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About This Item

 

Full Description

Describes the solder bath wetting balance and globule wetting balance methods of test. Both are applicable to components with metallic terminations and metallized solder pads. To be read in conjunction with BS EN 60068-1:1995

Cross References: BS 2011:Part 2.1T*BS 2011:Part 2.1Ta*BS EN 29453*BS EN 29454-1*BS EN 60068-1*BS EN 60068-2-44*ISO 683*ISO 6362*ISO 9453*
 

Document History

  1. BS EN 60068-2-69:2017+A1:2019


    Environmental testing-Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

    • Most Recent
  2. BS EN 60068-2-69:2017


    Environmental testing-Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

    • Historical Version
  3. BS EN 60068-2-69:2007


    Environmental testing-Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

    • Historical Version
  4. BS EN 60068-2-54:2006


    Environmental testing-Tests-Test Ta: Solderability testing of electronic components by the wetting balance method

    • Historical Version
  5. BS EN 60068-2-69:1996

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    Environmental testing. Test methods-Tests. Test Te. Solderability testing of electronic components for surface mount technology by the wetting balance method

    • Historical Version
  6. BS 2011-2.1TA:1989


    Environmental testing. Tests-Test Ta. Soldering. Solderability testing by the wetting balance method

    • Historical Version