1100725

BS 2011-2.1TA:1989

Environmental testing. Tests-Test Ta. Soldering. Solderability testing by the wetting balance method

standard by BSI Group , 04/28/1989

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About This Item

 

Full Description

Determinaton of the solderability of component terminations of any shape. Suitable for reference testing and for components that cannot be quantitatively tested by other methods. To be read in conjunction with BS 2011:Part 1.1

Cross References: BS 2011:Part 2.1T*
 

Product Details

Published:
04/28/1989
ISBN(s):
0580391329
Number of Pages:
14
File Size:
1 file , 480 KB
Product Code(s):
194382, 194382, 00194382
Note:
This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. BS EN 60068-2-69:2017+A1:2019


    Environmental testing-Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

    • Most Recent

  2. BS EN 60068-2-69:2017


    Environmental testing-Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

    • Historical Version

  3. BS EN 60068-2-69:2007


    Environmental testing-Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

    • Historical Version

  4. BS EN 60068-2-54:2006


    Environmental testing-Tests-Test Ta: Solderability testing of electronic components by the wetting balance method

    • Historical Version

  5. BS EN 60068-2-69:1996


    Environmental testing. Test methods-Tests. Test Te. Solderability testing of electronic components for surface mount technology by the wetting balance method

    • Historical Version

  6. BS 2011-2.1TA:1989

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    Environmental testing. Tests-Test Ta. Soldering. Solderability testing by the wetting balance method

    • Historical Version