1102034

BS 3934-5:1997

Mechanical standardization of semiconductor devices-Recommendations applying to tape automated bonding (TAB) of integrated circuits

standard by BSI Group , 09/15/1997

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About This Item

 

Full Description

Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).
 

Product Details

Published:
09/15/1997
ISBN(s):
0580278123
Number of Pages:
38
File Size:
1 file , 940 KB
Product Code(s):
1094344, 1094344, 01094344
Note:
This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. BS 3934-5:1997

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    Mechanical standardization of semiconductor devices-Recommendations applying to tape automated bonding (TAB) of integrated circuits

    • Most Recent

  2. BS 3934-5:1992


    Mechanical standardization of semiconductor devices-Recommendations for tape automated bonding (TAB) of integrated circuits

    • Historical Version

  3. BS 3934:ADDENDUM NO. 6:1989


    Mechanical standardization of semiconductor devices

    • Historical Version

  4. BS 3934:ADDENDUM NO. 5:1983


    Mechanical standardization of semiconductor devices

    • Historical Version

  5. BS 3934:ADDENDUM NO. 4:1980


    Mechanical standardization of semiconductor devices

    • Historical Version

  6. BS 3934:ADDENDUM NO. 3:1975


    Mechanical standardization of semiconductor devices

    • Historical Version

  7. BS 3934:ADDENDUM NO. 2:1971


    Mechanical standardization of semiconductor devices

    • Historical Version

  8. BS 3934:ADDENDUM NO. 1:1967


    Mechanical standardization of semiconductor devices

    • Historical Version

  9. BS 3934:1965


    Specification for dimensions of semiconductor devices and integrated electronic circuits

    • Historical Version