Std

BS 3934-5:1992

Mechanical standardization of semiconductor devices-Recommendations for tape automated bonding (TAB) of integrated circuits

standard by BSI Group , 04/01/1992

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About This Item

 

Full Description

Recommendations cover the requirements resulting from the sale of tape with or without bonded integrated circuits by a manufacturer to a user. They are not intended to govern strictly internal usage such as the use of TAB as one step in the manufacture of DIL packages or 'chip carriers'.

All current amendments available at time of purchase are included with the purchase of this document.
 

Product Details

Published:
04/01/1992
ISBN(s):
058020250X, 058020250
Number of Pages:
16
File Size:
1 file
Product Code(s):
261416, 261416, 261416
Note:
This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. BS 3934-5:1997


    Mechanical standardization of semiconductor devices-Recommendations applying to tape automated bonding (TAB) of integrated circuits

    • Most Recent

  2. BS 3934-5:1992

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    Mechanical standardization of semiconductor devices-Recommendations for tape automated bonding (TAB) of integrated circuits

    • Historical Version

  3. BS 3934:ADDENDUM NO. 6:1989


    Mechanical standardization of semiconductor devices

    • Historical Version

  4. BS 3934:ADDENDUM NO. 5:1983


    Mechanical standardization of semiconductor devices

    • Historical Version

  5. BS 3934:ADDENDUM NO. 4:1980


    Mechanical standardization of semiconductor devices

    • Historical Version

  6. BS 3934:ADDENDUM NO. 3:1975


    Mechanical standardization of semiconductor devices

    • Historical Version

  7. BS 3934:ADDENDUM NO. 2:1971


    Mechanical standardization of semiconductor devices

    • Historical Version

  8. BS 3934:ADDENDUM NO. 1:1967


    Mechanical standardization of semiconductor devices

    • Historical Version

  9. BS 3934:1965


    Specification for dimensions of semiconductor devices and integrated electronic circuits

    • Historical Version