2100874

JIS C 60068-2-69:2019

Environmental testing -- Part 2-69: Tests -- Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

standard by Japanese Industrial Standard / Japanese Standards Association , 01/01/2019

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JIS C 60068-2-69:2019 outlines test Te (Solderability testing of printed board) and test Tc [Solderability testing by balancing method, with assessment based on quantitative assessment criteria (wetting time and wettability)], the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations on electronic components and printed boards. Data obtained by these methods are not intended to be used as absolute quantitative data for pass-fail purposes.
 

Product Details

Published:
01/01/2019
Number of Pages:
61
File Size:
1 file , 640 KB
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This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. JIS C 60068-2-69:2019

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    Environmental testing -- Part 2-69: Tests -- Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

    • Most Recent

  2. JIS C 60068-2-69:2009


    Environmental testing -- Part 2-69: Tests -- Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method (Foreign Standard)

    • Historical Version