1748741

JIS C 60068-2-69:2009

Environmental testing -- Part 2-69: Tests -- Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method (Foreign Standard)

standard by Japanese Industrial Standard / Japanese Standards Association , 01/01/2009

This document has been replaced. View the most recent version.

View all product details

Historical

Track It

Language:
    • Available Formats
    •  
    • Availability
    • Priced From ( in USD )
    • Printed Edition
    • Ships in 1-2 business days
    • $174.00
    • Add to Cart

Customers Who Bought This Also Bought

 

About This Item

 

Product Details

Published:
01/01/2009
File Size:
1 file , 1.5 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. JIS C 60068-2-69:2019


    Environmental testing -- Part 2-69: Tests -- Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

    • Most Recent

  2. JIS C 60068-2-69:2009

    👀 currently
    viewing


    Environmental testing -- Part 2-69: Tests -- Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method (Foreign Standard)

    • Historical Version