1762673

JEDEC JESD51-4

THERMAL TEST CHIP GUIDELINE (WIRE BOND TYPE CHIP)

standard by JEDEC Solid State Technology Association , 02/01/1997

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Full Description

This guideline describes design requirements for wire bond type semiconductor chips to be used for thermal resistance listing of IC packages. This document provides specific guidelines for chip design but allows flexibility in the materials and layout requirements.
 

Product Details

Published:
02/01/1997
Number of Pages:
15
File Size:
1 file , 310 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. JEDEC JESD51-4A


    Thermal Test Chip Guideline (Wire Bond Type Chip)

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  2. JEDEC JESD51-4

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    THERMAL TEST CHIP GUIDELINE (WIRE BOND TYPE CHIP)

    • Historical Version