1779666

JEDEC JESD22-B118

SEMICONDUCTOR WAFER AND DIE BACKSIDE EXTERNAL VISUAL INSPECTION

standard by JEDEC Solid State Technology Association , 03/01/2011

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Full Description

This inspection method is for product semiconductor wafers and dice prior to assembly. This test method defines the requirements to execute a standardized external visual inspection and is a non-invasive and nondestructive examination that can be used for qualification, quality monitoring, and lot acceptance.
 

Product Details

Published:
03/01/2011
Number of Pages:
18
File Size:
1 file , 770 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. JEDEC JESD22-B118A


    Semiconductor Wafer and Die Backside External Visual Inspection

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    SEMICONDUCTOR WAFER AND DIE BACKSIDE EXTERNAL VISUAL INSPECTION

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