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JEDEC JESD217A

Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages

standard by JEDEC Solid State Technology Association , 11/01/2022

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Full Description

This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures.

 

Product Details

Published:
11/01/2022
Number of Pages:
48
File Size:
1 file , 2.2 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. JEDEC JESD217A

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    Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages

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  2. JEDEC JESD217A


    Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages

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  3. JEDEC JESD217.01


    TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES

    • Historical Version

  4. JEDEC JESD217


    TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES

    • Historical Version