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JEDEC JESD22-B112C

Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature

standard by JEDEC Solid State Technology Association , 11/01/2023

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Full Description

The purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of thermal conditions experienced during the surface-mount soldering operation.

 

Product Details

Published:
11/01/2023
File Size:
1 file , 1.9 MB
Note:
This product is unavailable in Russia, Belarus
 

Document History

  1. JEDEC JESD22-B112C

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    Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature

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  2. JEDEC JESD22-B112A


    PACKAGE WARPAGE MEASUREMENT OF SURFACE-MOUNT INTEGRATED CIRCUITS AT ELEVATED TEMPERATURE

    • Historical Version