Language:
    • Available Formats
    • Options
    • Availability
    • Priced From ( in USD )
    • Printed Edition
    • Ships in 1-2 business days
    • $74.00
    • Add to Cart
    • Printed Edition + PDF
    • Immediate download
    • $100.00
    • Add to Cart

Customers Who Bought This Also Bought

 

About This Item

 

Full Description

The purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of environmental conditions experienced during the surface-mount soldering operation.