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About This Item

 

Full Description

ISO 9453:2020 specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

An indication of the forms generally available is also included.

 

Document History

  1. ISO 9453:2020

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    Soft solder alloys - Chemical compositions and forms

    • Most Recent
  2. ISO 9453:2014


    Soft solder alloys - Chemical compositions and forms

    • Historical Version
  3. ISO 9453:2006


    Soft solder alloys - Chemical compositions and forms

    • Historical Version
  4. ISO 9453:1990


    Soft solder alloys - Chemical compositions and forms

    • Historical Version