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About This Item

 

Full Description

This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

All current amendments available at time of purchase are included with the purchase of this document.
 

Document History

  1. BS EN ISO 9453:2020

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    Soft solder alloys. Chemical compositions and forms

    • Most Recent
  2. BS EN ISO 9453:2014


    Soft solder alloys. Chemical compositions and forms

    • Historical Version
  3. BS EN ISO 9453:2006


    Soft solder alloys. Chemical compositions and forms

    • Historical Version
  4. BS EN 29453:1994


    Soft solder alloys. Chemical compositions and forms

    • Historical Version
  5. BS 219:1977


    Specification for soft solders

    • Historical Version