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IEC 62453-302 Ed. 1.0 en:2009

Field device tool (FDT) interface specification - Part 302: Communication profile integration - IEC 61784 CPF 2

standard by International Electrotechnical Commission , 06/30/2009

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IEC 62453-302:2009(E) provides information for integrating the CIP technology into the FDT interface specification (IEC 62453-2). It specifies communication and other services. This specification neither contains the FDT specification nor modifies it. Communication Profile Family 2 (commonly known as CIPTM1) defines communication profiles based on IEC 61158-2 Type 2, IEC 61158-3-2, IEC 61158-4-2, IEC 61158-5-2, IEC 61158-6-2, and IEC 62026-3. The basic profiles CP 2/1 (ControlNetTM2), CP 2/2 (EtherNet/IPTM3), and CP 2/3 (DeviceNetTM1) are defined in IEC 61784-1 and IEC 61784-2. An additional communication profile (CompoNetTM1), also based on CIPTM, is defined in [14].

This publication is to be read in conjunction with IEC 62453-2:2009.
 

Product Details

Edition:
1.0
Published:
06/30/2009
Number of Pages:
32
File Size:
1 file , 1.4 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada
 

Document History

  1. IEC 62453-302 Ed. 3.0 b:2023


    Field device tool (FDT) interface specification – Part 302: Communication profile integration – IEC 61784 CPF 2

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  2. IEC 62453-302 Ed. 2.0 b:2016


    Field device tool (FDT) interface specification - Part 302: Communication profile integration - IEC 61784 CPF 2

    • Historical Version

  3. IEC 62453-302 Ed. 1.0 b:2009


    Field device tool (FDT) interface specification - Part 302: Communication profile integration - IEC 61784 CPF 2

    • Historical Version

  4. IEC 62453-302 Ed. 1.0 en:2009

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    Field device tool (FDT) interface specification - Part 302: Communication profile integration - IEC 61784 CPF 2

    • Historical Version