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IEC 62453-302 Ed. 1.0 b:2009

Field device tool (FDT) interface specification - Part 302: Communication profile integration - IEC 61784 CPF 2

standard by International Electrotechnical Commission , 06/30/2009

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Full Description

IEC 62453-302:2009 provides information for integrating the CIP technology into the FDT interface specification (IEC 62453 2). It specifies communication and other services. This part, in conjunction with the other parts of the first edition of the IEC 62453 series cancels and replaces IEC/PAS 62453-1, IEC/PAS 62453-2, IEC/PAS 62453-3, IEC/PAS 62453-4 and IEC/PAS 62453-5 published in 2006, and constitutes a technical revision. This bilingual version (2013-07) corresponds to the monolingual English version, published in 2009-06.

This publication is to be read in conjunction withIEC 62453-2:2009.
 

Product Details

Edition:
1.0
Published:
06/30/2009
Number of Pages:
67
File Size:
1 file , 570 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada
 

Document History

  1. IEC 62453-302 Ed. 3.0 b:2023


    Field device tool (FDT) interface specification – Part 302: Communication profile integration – IEC 61784 CPF 2

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  2. IEC 62453-302 Ed. 2.0 b:2016


    Field device tool (FDT) interface specification - Part 302: Communication profile integration - IEC 61784 CPF 2

    • Historical Version

  3. IEC 62453-302 Ed. 1.0 b:2009

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    Field device tool (FDT) interface specification - Part 302: Communication profile integration - IEC 61784 CPF 2

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  4. IEC 62453-302 Ed. 1.0 en:2009


    Field device tool (FDT) interface specification - Part 302: Communication profile integration - IEC 61784 CPF 2

    • Historical Version