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IEC 61189-3 Ed. 1.1 b:2006 [ Withdrawn ]

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) CONSOLIDATED EDITION

standard by International Electrotechnical Commission , 11/27/2006

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Full Description

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods. This consolidated version consists of the first edition (1997) and its amendment 1 (1999). Therefore, no need to order amendment in addition to this publication.
 

Product Details

Edition:
1.1
Published:
11/27/2006
Number of Pages:
141
File Size:
1 file , 1 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada
 

Document History

  1. IEC 61189-3 Ed. 2.0 b:2007


    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

    • Most Recent

  2. IEC 61189-3 Ed. 2.0 en:2007


    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

    • Historical Version

  3. IEC 61189-3 Ed. 1.1 b:2006

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    Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) CONSOLIDATED EDITION

    • Historical Version