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IEC 61189-3 Ed. 1.0 b:1997 [ Withdrawn ]

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

standard by International Electrotechnical Commission , 04/10/1997

📝 Amendments Available

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About This Item

 

Full Description

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods.
 

Product Details

Edition:
1.0
Published:
04/10/1997
Number of Pages:
105
File Size:
1 file , 500 KB
Part of:
IEC 61189-3 Ed. 1.1 b:2006
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada
 

Amendments, rulings, supplements, and errata

  1. IEC 61189-3 Amd.1 Ed. 1.0 b:2006


    Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

  2. IEC 61189-3 Amd.1 Ed. 1.0 en:1999


    Amendment 1