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IEC 60749-19 Ed. 1.0 b:2003

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

standard by International Electrotechnical Commission , 02/13/2003

📝 Amendments Available

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About This Item

 

Full Description

Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.
 

Product Details

Edition:
1.0
Published:
02/13/2003
Number of Pages:
11
File Size:
1 file , 200 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada
 

Amendments, rulings, supplements, and errata

  1. IEC 60749-19 Amd.1 Ed. 1.0 b:2010


    Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength