This document establishes a test method for immunity scanning of ICs, modules, and PCBAs. Results from near-field immunity scanning relate to the system level behavior but cannot predict system level performance using the IEC 61000-4-2 test method. The reason is that variations exist in coupling paths between injection points and local current densities and associated fields coupled into traces or ICs.
This test method focuses on soft failures, such as bit errors and upsets, keeping in mind that fast pulses can also cause latch-up. The document will guide the user in identifying the root causes of ESD induced soft failures in components, such as ICs, modules, and PCBAs, for debugging and quality control purposes.