Std

BS 05/30133283 DC

IEC 61190-1-2 ED 2. Attachment materials for electronic assembly. Part 1-2. Requirements for soldering paste for high-quality interconnects in electronics assembly

standard by BSI Group , 05/04/2005

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Cross References: ISO 9000*ISO 9001*ISO 9002*ISO 9453 *ISO 9454-2*ISO 10012-1*IEC 60194*IEC 61190-1-1*IEC 61190-1-3*IEC 61191-1*IEC 61191-2*IEC 61191-3*IEC 61191-4*IEC 61189-5 *IEC 61189-6*
 

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Published:
05/04/2005
Number of Pages:
18
 

Document History

  1. BS EN 61190-1-2:2014


    Attachment materials for electronic assembly-Requirements for soldering pastes for high-quality interconnects in electronics assembly

    • Most Recent

  2. BS EN 61190-1-2:2007


    Attachment materials for electronic assembly-Requirements for soldering pastes for high-quality interconnects in electronics assembly

    • Historical Version

  3. BS 05/30133283 DC

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    IEC 61190-1-2 ED 2. Attachment materials for electronic assembly. Part 1-2. Requirements for soldering paste for high-quality interconnects in electronics assembly

    • Historical Version

  4. BS EN 61190-1-2:2002


    Attachment materials for electronic assembly-Requirements for solder pastes for high-quality interconnections in electronic assembly

    • Historical Version