Language:
    • Available Formats
    •  
    • Availability
    • Priced From ( in USD )
    • Printed Edition
    • Ships in 1-2 business days
    • $18.00
    • Add to Cart

Customers Who Bought This Also Bought

 

About This Item

 

Full Description

THIS PAPER SHOWS HOW NEW INSTRUMENTATION IS USED TO PROVIDE REAL-TIME HEIGHT OR MATERIAL VOLUME MEASUREMENTS FOR IMPROVED SMT PROCESS CONTROL. EXAMPLES ARE GIVEN OF 3-D METROLOGY FOR INSPECTING THICK FILM RESISTORS, SOLDER PASTE VOLUME, REFLOWED SOLDER, SOLDER MASK, TAPE AUTOMATED BONDING, LEAD COPLANARITY, AND CERAMIC PACKAGES. A SPECIFIC EXAMPLE OF YIELD IMPROVEMENTS USING 3-D MEASUREMENTS IS GIVEN.