920094

SME MR95-164

Resin Bond Cbn Wheels Wear Analysis Through The Chip Geometry

standard by Society of Manufacturing Engineers , 06/01/1995

Oliveira, Joao F.G. ; Bianchi, E.C. ; Souza, G.F.

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Full Description

THIS WORK SHOWS AN EXPERIMENTAL RESEARCH ABOUT THE BEHAVIOR OF A CBN RESIN BOND WHEEL DURING A TOOL AND A HARDENED STEEL GRINDING. THE WHEEL WEAR PHENOMENA IS STUDIED WITH EMPHASIS ON BOND WEAR AND GRAIN WEAR MECHANISMS. THE EQUILIBRIUM BETWEEN BOND RETENTION FORCE AND CUTTING FORCE PER GRAIN IS STUDIED THROUGH GRINDING TESTS. THE RESULTS ANALYSIS SHOWS THAT CBN WHEEL WEAR CAN BE REDUCED, IMPROVING THE (G) RATIO, BY THE REDUCTION OF THE BOND WEAR. THIS BOND WEAR CAN BE OPTIMIZED BY CHANGING THE UNDEFORMED CHIP GEOMETRY.
 

Product Details

Published:
06/01/1995
Number of Pages:
8
File Size:
1 file , 650 KB