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About This Item

 

Full Description

This specificiation covers a filled epoxy resin formulation, supplied as a two-component system, requiring an oven cure for attainment of maximum properties.
 

Document History

  1. SAE AMS3731/2D

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    Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, Low CTE Thermal Shock Resistant

    • Most Recent
  2. SAE AMS3731/2C


    POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Heat Cure, Low CTE Thermal Shock Resistant (Noncurrent: Jan 1993)

    • Historical Version