1641624

SAE AMS3690C

Adhesive Compound, Epoxy Room Temperature Curing

standard by SAE International , 07/20/2009

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Full Description

This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste.

This adhesive compound has been used typically for non-structural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components nd devices operating at not higher than 185 \mDF (85 \mDC), but usage is not limited to such applications.
 

Product Details

Published:
07/20/2009
File Size:
1 file , 82 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. SAE AMS3690D


    Adhesive Compound, Epoxy Room Temperature Curing (Stabilized: Nov 2016)

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    Adhesive Compound, Epoxy Room Temperature Curing

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