Std

MIL MIL-PRF-31032/2D

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting

standard by Military Specifications and Standards , 03/02/2020

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About This Item

 

Full Description

MIL-PRF-31032/2D covers the generic performance requirements for flexible, single and double sided (one or two conductor layers) printed wiring boards (hereafter designated printed board) with or without plated holes and with or without stiffeners that will use soldering for component/part mounting (see 6.1.1).
 

Product Details

Published:
03/02/2020
Number of Pages:
27
File Size:
1 file , 420 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. MIL MIL-PRF-31032/2D

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    Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting

    • Most Recent

  2. MIL MIL-PRF-31032/2C


    Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting

    • Historical Version

  3. MIL MIL-PRF-31032/2B


    Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting

    • Historical Version

  4. MIL MIL-PRF-31032/2A


    PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/2)

    • Historical Version

  5. MIL MIL-PRF-31032/2


    PRINTED WIRING BOARD RIGID, SINGLE AND DOUBLE LAYER, WOVEN E-GLASS REINFORCED THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED HOLES, FOR SOLDERING PART MOUNTING (S/S BY MIL-PRF-31032/2A)

    • Historical Version