1986129

MIL MIL-PRF-31032/1D

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

standard by Military Specifications and Standards , 06/01/2017

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About This Item

 

Full Description

This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, that will use soldering for component/part mounting (see 6.1.1).
 

Product Details

Published:
06/01/2017
Number of Pages:
39
File Size:
1 file , 660 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. MIL MIL-PRF-31032/1D

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    Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

    • Most Recent

  2. MIL MIL-PRF-31032/1C (all prev amd incorp.)


    Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

    • Historical Version

  3. MIL MIL-PRF-31032/1B


    PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/1A)

    • Historical Version

  4. MIL MIL-PRF-31032/1A


    PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/1) (S/S BY MIL-PRF-31032/1B)

    • Historical Version

  5. MIL MIL-PRF-31032/1


    PRINTED WIRING BOARD, RIGID, MULTILAYERED, WOVEN E-GLASS REINFORCED THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (S/S BY MIL-PRF-31032/1A)

    • Historical Version
 

Amendments, rulings, supplements, and errata

  1. MIL MIL-PRF-31032/1D Amendment 3


    Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

  2. MIL MIL-PRF-31032/1D Amendment 2


    Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

  3. MIL MIL-PRF-31032/1D Amendment 1


    Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting