1779594

JEDEC JESD51-32

THERMAL TEST BOARD STANDARDS TO ACCOMMODATE MULTI-CHIP PACKAGES

standard by JEDEC Solid State Technology Association , 12/01/2010

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Full Description

This document addresses the need for extending the existing thermal test board standards to accommodate the potential of higher electrical connection needs of multi-chip packages (MCPs) and the associated wire routing to implement these connections. The extensions described in this standard are also applicable to single chip packages needing more than 36 electrical connections for the test.
 

Product Details

Published:
12/01/2010
Number of Pages:
10
File Size:
1 file , 38 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus