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About This Item

 

Full Description

This standard applies to boards/assemblies, to identify the type of Pb-free or Pb-containing solder used. This standard documents a method for identifying board surface finishes and Printed Circuit Board (PCB) resin systems. This standard applies to PCB base materials and for marking the type of conformal coating utilized on Printed Circuit Board Assemblies (PCBAs). Material and their containers previously marked or labeled according to JESD 97 or IPC-1066 need not be remarked unless agreed upon by the supplier and customer.
 

Document History

  1. JEDEC J-STD-609C.01


    Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly

    • Most Recent
  2. JEDEC J-STD-609C


    Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly

    • Historical Version
  3. JEDEC J-STD-609B


    MARKING, SYMBOLS, AND LABELS OF LEADED AND LEAD-FREE TERMINAL FINISHED MATERIALS USED IN ELECTRONIC ASSEMBLY

    • Historical Version
  4. JEDEC J-STD-609A.01


    AND LABELING OF COMPONENTS, PCBs AND PCBAs TO IDENTIFY LEAD (Pb), Pb-FREE AND OTHER ATTRIBUTES

    • Historical Version
  5. JEDEC J-STD-609

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    MARKING AND LABELING OF COMPONENTS, PCBs AND PCBAs TO IDENTIFY LEAD (Pb), Pb-FREE AND OTHER ATTRIBUTES

    • Historical Version