16771

IPC J-STD-005

Requirements for Soldering Pastes, Includes Amendment 1 (2007)

standard by Association Connecting Electronics Industries , 01/01/1995

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About This Item

 

Full Description

Lists general requirements for characterization and test of metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. (This is a quality control document and is not intended to relate directly to a material's performance in the manufacturing process). Supersedes QQ-S-571.
 

Product Details

Published:
01/01/1995
ANSI:
ANSI Approved
Number of Pages:
38
File Size:
1 file , 320 KB
Part of:
IPC A-20/21-GKIT
Product Code(s):
J-005(D)1
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. IPC J-STD-005A


    Requirements for Soldering Pastes

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    Requirements for Soldering Pastes, Includes Amendment 1 (2007)

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