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About This Item

 

Full Description

IPC J-STD-001F is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. this revision includes support for traditional solder alloys and for lead-free manufacturing. Examples of some of the significant changes are revisions to plated-through-hole, PTH, minimum fill requirements; criteria for two new SMT termination types; and expanded conformal coating criteria. Whenever possible, the criteria descriptions have been adjusted to make them easier to understand for materials, methods and verification for producing quality soldered interconnections and assemblies. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This standard fully complements IPC-A-610F.
 

Document History

  1. IPC J-STD-001G


    Requirements for Soldered Electrical and Electronic Assemblies

    • Most Recent
  2. IPC J-STD-001F-WAM1


    Requirements for Soldered Electrical and Electronic Assemblies with Amendment 1

    • Historical Version
  3. IPC J-STD-001F

    👀currently
    viewing


    Requirements for Soldered Electrical and Electronic Assemblies

    • Historical Version
  4. IPC J-STD-001E


    Requirements for Soldered Electrical and Electronic Assemblies

    • Historical Version
  5. IPC J-STD-001D


    Requirements for Soldered Electrical and Electronic Assemblies

    • Historical Version
  6. IPC J-STD-001C


    Requirements for Soldered Electrical and Electronic Assemblies

    • Historical Version
  7. IPC J-STD-001B


    Requirements for Soldered Electrical and Electronic Assemblies

    • Historical Version
 

Amendments, rulings, supplements, and errata

  1. IPC J-STD-001FS


    Space Applications Electronic Hardware Addendum to J-STD-001F