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About This Item

 

Full Description

The purpose of this standard is to identify the moisture sensitivity classification level of passive surface mount devices and through-hole components, subjected to reflow soldering, so that they can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during the assembly solder reflow attachment and/or repair operation. This standard may be used to determine what classification level should be used for initial reliability qualification.
 

Document History

  1. IPC J-STD-075A


    Classification of Non-IC Electronic Components for Assembly Processes

    • Most Recent
  2. IPC J-STD-075


    Classification of Non-IC Electronic Components for Assembly Processes

    • Historical Version
  3. IPC 9503

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    Moisture Sensitivity Classification for Non-IC Components

    • Historical Version