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About This Item

 

Full Description

Covers the requirements for high speed / high frequency laminate or bonding layers to be used primarily for the fabrication of rigid or multilayer printed boards for high speed / high frequency electrical and electronic circuits. Some of the improvements over the IPC-L-125A specification include updated bonding layer testing parameters, inspection lot requirements, revised visual acceptance criteria, and new specification sheets for hydrocarbon and polyester resin systems. Supersedes IPC-L-125A.
 

Document History

  1. IPC 4103B


    Specification for Base Materials for High Speed/High Frequency Applications

    • Most Recent
  2. IPC 4103A-WAM1


    Specification for Base Materials for High Speed/High Frequency Applications with Amendment 1

    • Historical Version
  3. IPC 4103A


    Specification for Base Materials for High Speed/High Frequency Applications

    • Historical Version
  4. IPC 4103

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    Specification for Base Materials for High Speed/High Frequency Applications

    • Historical Version