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IPC 1601

Printed Board Handling and Storage Guidelines

standard by Association Connecting Electronics Industries , 08/01/2010

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Full Description

The industry's sole guideline on the handling, packaging and storage of printed boards. The guidelines in this document are intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, establishing recommended moisture levels, establishing baking profiles for moisture removal and the impact of baking on printed board solderability.
 

Product Details

Published:
08/01/2010
Number of Pages:
28
File Size:
1 file , 1.1 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. IPC 1601A


    Printed Board Handling and Storage Guidelines

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    Printed Board Handling and Storage Guidelines

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