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IEC/TR 61760-5-1 Ed. 1.0 en:2024

Surface Mounting Technology - Part 5-1: Surface Strain On Circuit Boards - Strain Gauge Measurement Applied To Chip Components

standard by International Electrotechnical Commission - Technical Report , 01/01/2024

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Full Description

This document describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called “bending cracks”. Area-array components are excluded from the scope of this document.

 

Product Details

Edition:
1.0
Published:
01/01/2024
ISBN(s):
9782832281604
Number of Pages:
28
File Size:
1 file , 4.5 MB
Note:
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