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IEC 61189-5 Ed. 1.0 b:2006

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

standard by International Electrotechnical Commission , 08/29/2006

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Full Description

IEC 61189-5:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.
 

Product Details

Edition:
1.0
Published:
08/29/2006
Number of Pages:
122
File Size:
1 file , 3.7 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada
 

Document History

  1. IEC 61189-5 Ed. 1.0 b:2006

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    Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

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  2. IEC 61189-5 Ed. 1.0 en:2006


    Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

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