1030547 Preview

IEC 61188-5-1 Ed. 1.0 b:2002 [ Withdrawn ]

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

standard by International Electrotechnical Commission , 07/12/2002

View all product details

Most Recent

Track It

Language:
    • Available Formats
    • Options
    • Availability
    • Priced From ( in USD )
    • Printed Edition
    • Ships in 1-2 business days
    • $451.00
    • Add to Cart

Customers Who Bought This Also Bought

 

About This Item

 

Full Description

Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.
 

Product Details

Edition:
1.0
Published:
07/12/2002
Number of Pages:
141
File Size:
1 file , 6.2 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada