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IEC 60749-30 Ed. 2.0 b:2020

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

standard by International Electrotechnical Commission , 08/17/2020

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Full Description

IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation.
 

Product Details

Edition:
2.0
Published:
08/17/2020
Number of Pages:
26
File Size:
1 file , 1.1 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada
 

Document History

  1. IEC 60749-30 Ed. 2.0 b:2020

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    Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

    • Most Recent

  2. IEC 60749-30 Ed. 1.1 b:2011


    Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing CONSOLIDATED EDITION

    • Historical Version

  3. IEC 60749-30 Amd.1 Ed. 1.0 b:2011


    Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

    • Historical Version

  4. IEC 60749-30 Ed. 1.0 b:2005


    Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

    • Historical Version